Your Role and Responsibilities

IBM’s Research Division is looking for an experienced bonding & assembly research engineer with knowledge on Die-to-wafer, Die-to-laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York.

The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next-generation semiconductor packaging technologies.

Required Education: master degree

Preferred Education: Ph.D.

Required Technical and Professional Expertise

1) Experience with flip chip underfill/molding process

2) Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)

3) Basic understanding of packaging/assembly processes, material, laminate, and tools

4) Ability to debug errors and solve problems

5) Ability to work in a team environment

Required Education: master degree

Preferred Education: Ph.D.

Preferred Technical and Professional Expertise

• 1) Hands-on experience in semiconductor packaging technology
  2) Experience in flip chip assembly process, laminate technology,
  packaging reliability test, failure analysis, and semiconductor process.
  3) Experience with/ design of experiments, process controls, and statistical data analysis.
  Required Education: master degree
  Preferred Education: Ph.D.