Your Role and Responsibilities
IBM’s Research Division is looking for an experienced bonding & assembly research engineer with knowledge on Die-to-wafer, Die-to-laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York.
The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next-generation semiconductor packaging technologies.
Required Education: master degree
Preferred Education: Ph.D.
Required Technical and Professional Expertise
1) Experience with flip chip underfill/molding process
2) Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)
3) Basic understanding of packaging/assembly processes, material, laminate, and tools
4) Ability to debug errors and solve problems
5) Ability to work in a team environment
Required Education: master degree
Preferred Education: Ph.D.
Preferred Technical and Professional Expertise
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